The Amaoe reballing work support is a high-precision magnetic vise, specially designed for aligning, fixing
and restoring solder pads (tin pads) on BGA chips used in iOS and Android smartphones. This innovative device is configured
with an advanced magnetic positioning and leveling system, which instantly attracts and secures the steel stencils directly over the chip,
completely freeing both hands of the technician for highly efficient operation. The support is designed to completely lock any movement
or accidental slipping during the critical phase of scraping and applying solder paste, ensuring perfectly even distribution
and flawless formation of the contact balls. With an ergonomic and durable structure,
this tool is ideal for GSM laboratories that emphasize speed and micrometric precision.
Features:
- Fixing technology: Magnetic system for automatic leveling and alignment of steel stencils (magnetic positioning)
- Properties: Provides total anti-displacement stability during solder paste application and scraping
- Main advantage: Frees up both hands for enhanced control
- Applications: Repair of solder pads and micro-soldering on BGA chips (iPhone and Android phones)
- Usage: Simple, intuitive design, optimized for professional technicians and electronics enthusiasts